Capabilities
Here is a list of our standard capabilities and tolerances, however this is not a definitive listing,
if you require something out of the ordinary, please contact our sales office, and we will help with your request.
We have many customers in different industry sectors, whether it is automotive PCB solutions, LED lighting PCBs, aerospace PCB applications, or MOD (Ministry of Defence) PCB requirements. We understand your industry-specific needs and have suitable factories in the UK, Europe, and Asia to meet your demands.
Materials
FR4 (135tg,150tg,170tg) - Kingboard, ITEQ, Isola,Ventec, EMC, Panasonic, Taconic, Ventec
Halogen Free
Aluminium
Polyimide
​Flexible Circuits
PTFE & Rogers
Standard Capabilities
Layers = 1-36 Layers
Minimum board thickness ( with solder mask) = 0.20mm(rigid)
Maximum board thickness = 8mm
Minimum board size = 2.5mm x 2.5mm (panelised) 10x10mm (singles)
Maximum board size = 500mm x 1500mm
Minimum line/space innerlayer = 2.5mil/2.5mil(depends on copper weight)
Minimum line/space outerlayer = 2.5mil/2.5mil(depends on copper weight)
Surface finish types = OSP, ENiG, HASL (Leaded/Lead Free), Immersion Tin, Immersion Silver, Hard Gold, ENEPIG
Mechanical hole size ( Finish hole size) = 0.15mm
Maximum aspect ratio PTH = 12:1
Finished tolerance PTH (mm) = +/- 0.05
Finished tolerance NPTH (mm) = + / - 0.025
Epoxy filled through holes = 0.15mm to 0.50mm
Layers = 1-36 Layers
Capped via = 0.15mm to 0.50mm
Maximum copper weight outerlayer = 6oz
Tolerance depth drill (mm) = + / - 0.10
Backdrill diameter = 0.50mm
Min. depth of backdrill = 0.25mm
Drill depth tolerance(mm) = + / - 0.15
HDI type 1+n+1 = Yes
HDI type 2+n+2 = Yes
HDI type 3+n+3 = Yes
HDI type 4+n+4 = N/A
Min. laser hole diameter = 0.075mm
Microvia Max.aspect ratio = 1:1
Copper filled microvia = Yes
Resin filled microvia = Yes
Stacked & Staggered via. = Yes
Rigid-flex boards = Yes
Flex boards = Yes
IMS boards = Yes
Soldermask via plugging IPC4761 type VI = Yes
Epoxy via plugging IPC4761 type VI = Yes
Epoxy via plugging IPC4761 type VI = Yes
Standard Tolerances
Track & Gap = +/- 20%
Layer registration = +/- 0.10mm
Hole diameter = (PTH)+ 0.1mm / -0.05mm
Solder dam width (Min.) = 0.15mm
BGA & QFP pitch = 0.40mm
Impedance control = +/- 10%
% Tested (Opens & shorts) = 100 %