| Item | Capability | |
|---|---|---|
| 1 | Layers | 1 - 20 |
| 2 | Copper | 17µm > 140µm (0.5 > 4oz) |
| 3 | Materials | FR4, Standard & high Tg. (94-V0) |
| Aluminium | ||
| Flexible circuits | ||
| Polyimide, PTFE & Rogers | ||
| 4 | Surface Finishes | ENIG |
| HASL-Lead free | ||
| Immersion Silver | ||
| Immersion Tin | ||
| OSP | ||
| Hard gold and fingers | ||
| 5 | Solder resist & silkscreen | Photoimageable (Various colours) |
| Silkscreen (Various colours) | ||
| Via plugging mask | ||
| Peelable mask | ||
| 6 | CNC Drilling & profiling | Mechanical – 0.2mm |
| Laser – 0.1mm | ||
| Routing | ||
| V Scoring | ||
| Punching | ||
| 7 | Special requirements | Impedance controlled |
| Blind & buried vias | ||
| Edge plating, and plated slots | ||
| Countersinking | ||
| Punching |
| Item | Capability | |
|---|---|---|
| 1 | Track & Gap | +/- 20% |
| 2 | Layer registration | +/- 0.10mm |
| 3 | Hole diameter (PTH) | + 0.1mm / -0.05mm |
| 4 | Solder dam width (Min.) | 0.15mm |
| 5 | BGA & QFP pitch | 0.40mm |
| 6 | Impedance control | +/- 10% |
| 7 | % Tested (Opens & shorts) | 100 % |
| 8 | Minimum track & gap | 0.10mm |
